Wafer Abrading Machine Tender

Tend abrading machines that roughen surface of semiconductor wafers.
picture of Wafer Abrading Machine Tender

Quick Stats


Salary Range
$21,000 – $49,000

Data from U.S. Department of Labor


What do Wafer Abrading Machine Tenders do?

Tends abrading machines that roughen surface of semiconductor wafers to distinguish front from back: Adjusts controls to set speed, time, and pressure of abrading belts according to specifications. Loads container of wafers into abrading machine and starts machine that automatically abrades surface of wafer. Removes abraded wafers from machine and inspects wafers to detect abrading defects, such as cracks, using microscope. Replaces worn abrading belts.


Should I be a Wafer Abrading Machine Tender?

You should have a high school degree or higher and share these traits:
  • Levelheaded: You hold your emotions in check, even in tough situations.
  • Persistent: You keep pushing through, even when faced with tough obstacles.
  • Reliable: You can always be counted on to do a good job.

  • Also known as: Abrading Machine Tender

    How to Become a
    Wafer Abrading Machine Tender

    Most Wafer Abrading Machine Tenders have no higher education and get on-the-job training. Think about earning a Certificate or Associate's degree to increase your competitiveness in the field. Chart?chd=s:9zgaaa&chl=no+college+%2866%25%29|certificate+%2827%25%29|associate%27s+%287%25%29|||&cht=p3&chs=466x180&chxr=0,66,66
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