Prepare customers’ documents for printing by correcting errors or colors.
Attaches dies to empty integrated circuit packages to assemble complete semiconductor packages, using welding and gluing equipment: Places empty IC packages on heated chuck of equipment, using tweezers. Deposits bonding material, such as epoxy or gold alloy, on specified location of empty packages, and positions and aligns dies on bonding material in packages, using equipment or handtools. Removes packages with attached dies from chuck and places packages in trays, using tweezers. May place loaded trays in oven to set bonding material. May view positioning of epoxy and die in empty packages through microscope.